LG Innotek to slim down smartphones by replacing solder balls with copper posts

LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.

https://www.tomshardware.com/tech-industry/semiconductors/lg-innotek-to-slim-down-smartphones-by-replacing-solder-balls-with-copper-posts

 Chipmaking giant TSMC hit with class-action lawsuit in the U.S. for bias, racism, and unsafe conditions — over 30 plaintiffs have accused the company of illegal practices at Arizona fab

Over 30 current and former TSMC Arizona employees have joined a class-action lawsuit accusing the company of discriminating against American workers, enabling racist behavior, and maintaining unsafe conditions at its Fab 21 facility.

https://www.tomshardware.com/tech-industry/semiconductors/chipmaking-giant-tsmc-hit-with-class-action-lawsuit-in-the-u-s-for-b

 AI hyperscaler buys its cryptomining partner for its AI GPUs and data center infrastructure — CoreWeave acquires Core Scientific in long-awaited move

CoreWeave, a minor AI hyperscaler, has bought out its longtime partner, Core Scientific, to take control of its data center infrastructure. The companies have worked together for a long time, both emerging from the cryptomining era into AI hyperscaling.

https://www.tomshardware.com/tech-industry/artificial-intelligence/ai-hyperscaler-buys-its-cryptomining-pa


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