TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management for future AI and HPC processors.
Connectez-vous pour ajouter un commentaire
Autres messages de ce groupe
A trio of Apex Storage X16 Gen5 add-in cards were loaded with 32 Phison E28 Gen5 M.2 SSDs to achieve read speeds of 113.6 GB/s on Windows.
Colorful has shown off a raft of new products at Computex 2025.
be quiet! releases new updates to its PC case and AIO cooler product lines.
Zotac is showcasing compact low-profile and Mini-ITX versions of Nvidia’s GeForce RTX 5060 at Computex, plans to ship them later this year.
V-Color has unveiled its Xfinity Manta DDR5 memory modules featuring programmable LCD screens that display real-time system data, marking a novel step in enthusiast-grade
Jack Huynh, the Senior Vice President and GM of AMD's Computing and Graphics Group, will take the stage today in Taipei, Taiwan, for the company's Computex 2025 keynote.
AMD has revealed the chipmaker's latest Radeon AI Pro R9700 graphics card for specialized AI workstations.
