Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the company plans to deploy in production in the future.
Connectez-vous pour ajouter un commentaire
Autres messages de ce groupe
Ivan Miranda and Jon from Proper Printing have turned a treadmill into a working 3D printer with an endless print bed size.
According to data from CamelCamelCamel, this 64GB Crucial DDR5-5600 kit is now only $130 at Amazon, its lowest price to date.
Intel secures a jury verdict confirming that Fortress Investment Group controls VLSI Technology, a decision that may overturn more than $3 billion in patent infringement
TeamGroup has expanded its high-end PCIe 5.0 SSD lineup to six different families based on four controller vendors to cover a wide range of performance and price points.
Multiple makers of enthusiast-grade DRAM modules showcased CAMM2 memory at Computex 2025, but there are doubts about its adoption due to uncertain motherboard support and
Intel's latest drivers, thanks to new low-power optimizations, can improve FPS by 10% on Core Ultra 200V (Lunar Lake)- powered laptops and mini-PCs.
A leaked W880 motherboard document references an Intel Arrow Lake-S Refresh chip, pointing to a refresh of the Intel Core Ultra 200S processors.
