AMD Ryzen 7 9800X3D vs Intel Core Ultra 9 285K Faceoff — Battle of the Gaming Flagships

Today, we pit Intel's current-gen flagship Core Ultra 9 285K vs the Ryzen 7 9800X3D, the hands-down best CPU for gaming on the market, in a heated six-round match to find the winner.

https://www.tomshardware.com/pc-components/cpus/intel-core-ultra-9-285k-vs-amd-ryzen-7-9800x3d-faceoff-battle-of-the-gaming-flagships

 Realtek eyes SSDs with new PCIe 5.0 x4 DRAM-less controller — Up to 10 GB/s and 1.4M IOPS

Realtek is attempting to enter the SSD controller market with its RTS5781DL, a PCIe 5.0 DRAM-less controller that is now sampling. But can it compete with established players?

https://www.tomshardware.com/pc-components/ssds/realtek-eyes-ssds-with-new-pcie-5-0-x4-dram-less-controller-up-to-10-gb-s-and-1-4m-iops

 Molex demonstrates PCIe 7.0 cabling solution: 128 GT/s at 1 meter

Molex unveiled its Genesis connector and cable system at Computex, targeting future PCIe 7.0 deployments with a design optimized for 128 GT/s signaling.

https://www.tomshardware.com/peripherals/cables-connectors/molex-demonstrates-pcie-7-0-cabling-solution-128-gt-s-at-1-meter

 Dude, where's my GPU? — Microcenter customer gets backpack-stuffed box instead of RTX 5090

A customer received a Zotac Gaming GeForce RTX 5090 Solid OC but found the box packed with backpacks, prompting an investigation that revealed additional impacted cases.

https://www.tomshardware.com/pc-components/gpus/dude-wheres-my-gpu-microcenter-customer-gets-backpack-stuffed-box-instead-of-rtx-5090

 Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth

Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques that the company plans to deploy in production in the future.

https://www.tomshardware.com/pc-components/cpus/intel-details-new-advanced-packaging-breakthroughs-emib-t-paves-t


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