US government addresses domestic chipmaking weaknesses with $3 billion advanced packaging program as part of the CHIPS Act

The U.S. government is planning to subsidizing the creation of advanced packaging facilities in America with a $3 billion allocation of CHIPS funding.

https://www.tomshardware.com/news/us-government-addresses-domestic-chipmaking-weaknesses-with-advanced-packaging-program

Utworzony 2y | 21 lis 2023, 19:50:06


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