Kioxia and SanDisk start shipping BiCS9 3D NAND samples — hybrid design combining 112-layer BiCS5 with modern CBA and DDR6.0 interface for higher performance and cost efficiency

Kioxia has started shipping samples of its ninth‑generation BiCS FLASH 512 Gb TLC chips built with CBA tech — pairing legacy memory cell layers with modern CMOS controllers. The result: improved performance, efficiency, and lower cost, while paving way for high‑capacity BiCS 10 launches.

https://www.tomshardware.com/pc-components/storage/kioxia-and-sandisk-start-shipping-bics9-3d-nand-samples-hybrid-design-combining-112-layer-bics5-with-modern-cba-and-ddr6-0-interface-for-higher-performance-and-cost-efficiency

Utworzony 4h | 27 lip 2025, 14:50:05


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