SK hynix plans to build a $4 billion chip packaging facility in Indiana, which could begin operations in 2029, according to a WSJ report. If the plant gets the green light, likely with tax incentives, it would focus on advanced packaging like that used for HBM3e and future HBM solutions.
Chcete-li přidat komentář, přihlaste se
Ostatní příspěvky v této skupině
AMD's Zen 4-based entry-level EPYC 4004-series processors for the AM5 socket have surfaced on eBay.
Intel is reportedly in talks with Apollo, KKR, and Stonepeak regarding funding for a new plant in Ireland.
King Yuan sells off its China subsidiary due to geopolitics, U.S. sanctions against China, rising competition, and ability to earn more in Taiwan.
TSMC preps 8x reticle size or larger interposers for gargantuan AI and HPC SiPs.
Despite efforts of U.S. government, HiSilicon continues to develop high-end SoCs and SMIC continues to make them.
After a short break, Pi Wars 2024 sees the return of the premier in-person robotics event and with 58 teams competing for the crown, competition was fierce, but competito
Intel issues a state regarding stability issues concerning 13th and 14th Generation CPUs on 600-and 700-series motherboards made by respective manufacturers.
